SK EN 61190-1-2:2015
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Status: Published
Gjuha: English Faqe: 27 Publikuar: 2015-06-24 Regjistri Kombëtar: Botim: |
Standardet ndërkombëtare që kanë lidhje
This standard is identical to:
EN 61190-1-2:2014 CLC/SR 91 |
Çmim: 28 €
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Titulli Shqip
Materiale lidhës për bashkuesit elektronike-Pjesa 1-2: Kërkesat për pastat e saldimit për ndërlidhje të cilësisë së lartë në bashkimet elektronike
Titulli Anglisht
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Scope Shqip
Asnjë informacion i shtuar.
Scope Anglisht
IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material''s performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition: a) modification of the solder powder size in Table 2; b) addition of the information of ''Reflow condition and profile'' in Annex B; c) addition of a new Annex C.